01037-1N23WE: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.800 INCHES MINIMUM AND 0.840 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN, overall_diameter: 0.222 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN, special_features: INCLUDES REMOVABLE BASE ADAPTER 0.242 IN LG MIN 0.256 IN MAX 0.292 IN DIA MIN 0.296 IN DIA MAX IN. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-615-4309, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.800 INCHES MINIMUM AND 0.840 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN |
| overall_diameter | 0.222 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN |
| special_features | INCLUDES REMOVABLE BASE ADAPTER 0.242 IN LG MIN 0.256 IN MAX 0.292 IN DIA MIN 0.296 IN DIA MAX IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 PIN |
| NSN | 5961-00-615-4309 |
| OVERALL DIAMETER | 0.222 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN |
| MOUNTING METHOD | TERMINAL |
| OVERALL LENGTH | 0.800 INCHES MINIMUM AND 0.840 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| SPECIAL FEATURES | INCLUDES REMOVABLE BASE ADAPTER 0.242 IN LG MIN 0.256 IN MAX 0.292 IN DIA MIN 0.296 IN DIA MAX IN |
| END ITEM IDENTIFICATION | SONAR SIGNAL PROCESSING SYS, AN/SQQ-28(V); COMMUNICATIONS SYSTEMS, AN/WRR-7; HELICOPTER, ADVANCE ATTACK, AH-1W; FIRE PUMPS; FIRE CONTROL SYSTEM, MK 92 (FCS); AIRCRAFT, C-2A (REPROCURED); AIRCRAFT, SOF (AC-130H, MC-130H, EC-130E, HC-130; HELICOPTER, MH-53E; DEEP SUKBMERGENCE SYSTEMS PROGRAM (DSSP) A |
| MATERIAL | SILICON SEMICONDUCTOR |
| MATERIAL | GLASS ENCLOSURE |
| TERMINAL TYPE AND QUANTITY | 2 PIN |