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Technical Data Sheet
PartsTable / COMPONENT / IM5610MDE
IM5610MDE ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.294 INCHES MAXIMUM IN, body_height: 0.179 INCHES MAXIMUM IN, body_length: 0.808 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-027-3791, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
IM5610MDE
NSN: 5962-01-027-3791
FSC: 5962
CAGE: 32293 — INTERSIL INC SUB OF GENERAL ELECTRIC CO (USA)
SPECIFICATIONS
body_width0.294 INCHES MAXIMUM IN
body_height0.179 INCHES MAXIMUM IN
body_length0.808 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedBIPOLAR AND HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND HIGH SPEED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 165.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
end_item_identificationRADAR SET,TYPE AN/TPS-43E
NSN5962-01-027-3791
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN IM5610MDE MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
MEMORY DEVICE TYPE: ROM
•
TEST DATA DOCUMENT: 24930-G390452 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
•
MEMORY CAPACITY: UNKNOWN
•
TERMINAL SURFACE TREATMENT: SOLDER
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
MAXIMUM POWER DISSIPATION RATING1.0 WATTS
INCLOSURE MATERIALCERAMIC AND GLASS
MEMORY DEVICE TYPEROM
TEST DATA DOCUMENT24930-G390452 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
VOLTAGE RATING AND TYPE PER CHARACTERISTIC1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
MEMORY CAPACITYUNKNOWN
TERMINAL SURFACE TREATMENTSOLDER
TIME RATING PER CHACTERISTIC50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 14
MMI5331-1JInterchangeable
interchangeable cross-reference
interchangeable
5331DInterchangeable
interchangeable cross-reference
interchangeable
MM5531DInterchangeable
interchangeable cross-reference
interchangeable
635A327H01Interchangeable
interchangeable cross-reference
interchangeable
IM5610MJEInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 013Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is IM5610MDE?
IM5610MDE is a MICROCIRCUIT,MEMORY.
What parts can replace IM5610MDE?
There are 14 known substitutes for IM5610MDE: MMI5331-1J, 5331D, MM5531D and 11 more. Substitute compatibility should be verified for your specific system.
What is the NSN for IM5610MDE?
IM5610MDE is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-027-3791. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026