IM5610CDE — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IM5610CDE: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.294 INCHES MAXIMUM IN, body_height: 0.204 INCHES MAXIMUM IN, body_length: 0.808 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND W/ENABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-045-1026, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IM5610CDE

NSN: 5962-01-045-1026
NIINs: 010451026, 010567067, 010785485, 011139502, 011201247, 011331002, 011359086
FSC: 5962 — Microcircuits, Electronic
CAGE: 32293 — INTERSIL INC SUB OF GENERAL ELECTRIC CO (USA)

SPECIFICATIONS

body_width	0.294 INCHES MAXIMUM IN
body_height	0.204 INCHES MAXIMUM IN
body_length	0.808 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND W/ENABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
end_item_identification	A/F37A-T36 FSCM 22903
NSN	5962-01-045-1026

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.302 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.302 INCHES MAXIMUM IN
BODY HEIGHT	0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

52SPL-RGMKReference document

Same NSN cross-reference

Reference document — Design control — primary reference

N82S123FReference document

Same NSN cross-reference

Reference document — Secondary reference

IM5610CReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

ES52SPL-RGMKReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is IM5610CDE?

IM5610CDE is a MICROCIRCUIT,DIGITAL.

What parts can replace IM5610CDE?

There are 4 known substitutes for IM5610CDE: 52SPL-RGMK, N82S123F, IM5610C and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for IM5610CDE?

IM5610CDE is cataloged in the U.S. Government catalog under NSN 5962-01-045-1026. This indicates validated use in U.S. government and defense supply chains.

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