IDT7187L70LB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT7187L70LB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES NOMINAL IN, body_height: 0.076 INCHES NOMINAL IN, body_length: 0.490 INCHES NOMINAL IN, special_features: 64X1 RAM, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, memory_device_type: RAM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-396-5435, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT7187L70LB

NSN: 5962-01-396-5435
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	0.290 INCHES NOMINAL IN
body_height	0.076 INCHES NOMINAL IN
body_length	0.490 INCHES NOMINAL IN
special_features	64X1 RAM
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	22 LEADLESS
current_rating_per_characteristic	50.00 MILLIAMPERES NOMINAL OUTPUT
NSN	5962-01-396-5435

COMPONENT DIAGRAM

KEY FEATURES

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.290 INCHES NOMINAL IN

•

BODY HEIGHT: 0.076 INCHES NOMINAL IN

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

CURRENT RATING PER CHARACTERISTIC: 50.00 MILLIAMPERES NOMINAL OUTPUT

•

MEMORY DEVICE TYPE: RAM

•

BODY LENGTH: 0.490 INCHES NOMINAL IN

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.290 INCHES NOMINAL IN
BODY HEIGHT	0.076 INCHES NOMINAL IN
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CURRENT RATING PER CHARACTERISTIC	50.00 MILLIAMPERES NOMINAL OUTPUT
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.490 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPECIAL FEATURES	64X1 RAM

SUBSTITUTES & CROSS-REFERENCES 2

5962-8601508ZASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5962-86015Reference document

Same NSN cross-reference

Reference document — Identification reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is IDT7187L70LB?

IDT7187L70LB is a MICROCIRCUIT,MEMORY.

What parts can replace IDT7187L70LB?

There are 2 known substitutes for IDT7187L70LB: 5962-8601508ZA, 5962-86015. Substitute compatibility should be verified for your specific system.

What is the NSN for IDT7187L70LB?

IDT7187L70LB is cataloged in the U.S. Government catalog under NSN 5962-01-396-5435. This indicates validated use in U.S. government and defense supply chains.

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