5962-86015: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES NOMINAL IN, body_height: 0.076 INCHES NOMINAL IN, body_length: 0.490 INCHES NOMINAL IN, overall_height: 0.400 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, special_features: 64K X 1 RAM. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-283-4329, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.290 INCHES NOMINAL IN |
| body_height | 0.076 INCHES NOMINAL IN |
| body_length | 0.490 INCHES NOMINAL IN |
| overall_height | 0.400 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| special_features | 64K X 1 RAM |
| features_provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND STATIC OPERATION |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | RAM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-283-4329 |
| INPUT CIRCUIT PATTERN | 19 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 50.00 MILLIAMPERES NOMINAL OUTPUT |
| MEMORY DEVICE TYPE | RAM |
| BODY LENGTH | 1.260 INCHES MAXIMUM IN |