IDT6116S150CI — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT6116S150CI: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 13.4 MILLIMETERS NOMINAL MM, body_height: 5.3 MILLIMETERS NOMINAL MM, body_length: 32.0 MILLIMETERS NOMINAL MM, bit_quantity: 16384, word_quantity: 2048, features_provided: HIGH SPEED AND W/ENABLE AND W/DISABLE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-163-3311, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT6116S150CI

NSN: 5962-01-163-3311
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	13.4 MILLIMETERS NOMINAL MM
body_height	5.3 MILLIMETERS NOMINAL MM
body_length	32.0 MILLIMETERS NOMINAL MM
bit_quantity	16384
word_quantity	2048
features_provided	HIGH SPEED AND W/ENABLE AND W/DISABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	RAM
storage_temp_range	-55.0 TO 125.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	22 INPUT
NSN	5962-01-163-3311

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 16384

•

INPUT CIRCUIT PATTERN: 22 INPUT

•

WORD QUANTITY: 2048

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 13.4 MILLIMETERS NOMINAL MM

•

BODY HEIGHT: 5.3 MILLIMETERS NOMINAL MM

•

FEATURES PROVIDED: HIGH SPEED AND W/ENABLE AND W/DISABLE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	16384
INPUT CIRCUIT PATTERN	22 INPUT
WORD QUANTITY	2048
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	13.4 MILLIMETERS NOMINAL MM
BODY HEIGHT	5.3 MILLIMETERS NOMINAL MM
FEATURES PROVIDED	HIGH SPEED AND W/ENABLE AND W/DISABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM

SUBSTITUTES & CROSS-REFERENCES 1

HM6116P-4Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is IDT6116S150CI?

IDT6116S150CI is a MICROCIRCUIT,MEMORY.

What parts can replace IDT6116S150CI?

There is 1 known substitute for IDT6116S150CI: HM6116P-4. Substitute compatibility should be verified for your specific system.

What is the NSN for IDT6116S150CI?

IDT6116S150CI is cataloged in the U.S. Government catalog under NSN 5962-01-163-3311. This indicates validated use in U.S. government and defense supply chains.

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IDT6116S150CI — MICROCIRCUIT,MEMORY

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