HM6116P-4: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 13.4 MILLIMETERS NOMINAL MM, body_height: 5.29 MILLIMETERS MAXIMUM MM, body_length: 32.0 MILLIMETERS NOMINAL MM, bit_quantity: 16384, word_quantity: 2048, features_provided: HIGH SPEED AND LOW POWER AND W/ENABLE AND STATIC OPERATION. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-163-3311, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 13.4 MILLIMETERS NOMINAL MM |
| body_height | 5.29 MILLIMETERS MAXIMUM MM |
| body_length | 32.0 MILLIMETERS NOMINAL MM |
| bit_quantity | 16384 |
| word_quantity | 2048 |
| features_provided | HIGH SPEED AND LOW POWER AND W/ENABLE AND STATIC OPERATION |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | PLASTIC |
| memory_device_type | RAM |
| storage_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| input_circuit_pattern | 22 INPUT |
| NSN | 5962-01-163-3311 |
| BIT QUANTITY | 16384 |
| INPUT CIRCUIT PATTERN | 22 INPUT |
| WORD QUANTITY | 2048 |
| INCLOSURE MATERIAL | PLASTIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 13.4 MILLIMETERS NOMINAL MM |
| BODY HEIGHT | 5.3 MILLIMETERS NOMINAL MM |
| FEATURES PROVIDED | HIGH SPEED AND W/ENABLE AND W/DISABLE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | RAM |