IDT54FCT823BLB: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.460 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.460 INCHES MAXIMUM IN, features_provided: MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-302-6189, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.460 INCHES MAXIMUM IN |
| body_height | 0.100 INCHES MAXIMUM IN |
| body_length | 0.460 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 12 INPUT |
| end_item_identification | SEAWOLF CLASS SSN |
| inclosure_configuration | LEADLESS FLAT PACK |
| NSN | 5962-01-302-6189 |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 BUFFER, NONINVERTING |
| BODY WIDTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-4 MIL-M-38510 |
| BODY LENGTH | 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN |