41223-608-00-5 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

41223-608-00-5: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-302-6189, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

41223-608-00-5

NSN: 5962-01-302-6189
FSC: 5962 — Microcircuits, Electronic
CAGE: KC1M9 — BAE SYSTEMS MARITIME SERVICES LIMITED (GBR)

SPECIFICATIONS

body_width	0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 155.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-302-6189

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 BUFFER, NONINVERTING

•

BODY WIDTH: 0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 BUFFER, NONINVERTING
BODY WIDTH	0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN
BODY HEIGHT	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATOR	C-4 MIL-M-38510
BODY LENGTH	0.442 INCHES MINIMUM AND 0.460 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 1

IDT54FCT823BLBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 41223-608-00-5?

41223-608-00-5 is a MICROCIRCUIT,DIGITAL.

What parts can replace 41223-608-00-5?

There is 1 known substitute for 41223-608-00-5: IDT54FCT823BLB. Substitute compatibility should be verified for your specific system.

What is the NSN for 41223-608-00-5?

41223-608-00-5 is cataloged in the U.S. Government catalog under NSN 5962-01-302-6189. This indicates validated use in U.S. government and defense supply chains.

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41223-608-00-5 — MICROCIRCUIT,DIGITAL

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