HPR0M-1-8256-8 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HPR0M-1-8256-8: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN, bit_quantity: 256, features_provided: BURN IN AND HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-068-1602, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HPR0M-1-8256-8

NSN: 5962-01-068-1602
NIINs: 010681602, 010681603, 010681604, 010683628
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN
bit_quantity	256
features_provided	BURN IN AND HERMETICALLY SEALED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC OR METAL
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-65.0 TO 125.0 FAHRENHEIT DEGF
input_circuit_pattern	6 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-068-1602

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC OR METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN AND HERMETICALLY SEALED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC OR METAL
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND HERMETICALLY SEALED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

247ASC2390-009Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 022Reference document

Same NSN cross-reference

Reference document — Secondary reference

MM5330J/883BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is HPR0M-1-8256-8?

HPR0M-1-8256-8 is a MICROCIRCUIT,DIGITAL.

What parts can replace HPR0M-1-8256-8?

There are 3 known substitutes for HPR0M-1-8256-8: 247ASC2390-009, ROM/PROM FAMILY 022, MM5330J/883B. Substitute compatibility should be verified for your specific system.

What is the NSN for HPR0M-1-8256-8?

HPR0M-1-8256-8 is cataloged in the U.S. Government catalog under NSN 5962-01-068-1602. This indicates validated use in U.S. government and defense supply chains.

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