247ASC2390-009 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

247ASC2390-009: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN, features_provided: BURN IN AND HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC OR METAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-068-1602, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

247ASC2390-009

NSN: 5962-01-068-1602
FSC: 5962 — Microcircuits, Electronic
CAGE: 30003 — NAVAL AIR SYSTEMS COMMAND MANAGED ORIGINAL DESIGN ACTIVITY NOT MATERIAL/PARTS SUPPLIER (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN
features_provided	BURN IN AND HERMETICALLY SEALED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC OR METAL
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-65.0 TO 125.0 FAHRENHEIT DEGF
input_circuit_pattern	6 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-068-1602

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC OR METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN AND HERMETICALLY SEALED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC OR METAL
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND HERMETICALLY SEALED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

HPR0M-1-8256-8Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 022Reference document

Same NSN cross-reference

Reference document — Secondary reference

MM5330J/883BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 247ASC2390-009?

247ASC2390-009 is a MICROCIRCUIT,MEMORY.

What parts can replace 247ASC2390-009?

There are 3 known substitutes for 247ASC2390-009: HPR0M-1-8256-8, ROM/PROM FAMILY 022, MM5330J/883B. Substitute compatibility should be verified for your specific system.

What is the NSN for 247ASC2390-009?

247ASC2390-009 is cataloged in the U.S. Government catalog under NSN 5962-01-068-1602. This indicates validated use in U.S. government and defense supply chains.

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