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HP0300 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

HP0300: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.212 INCHES MAXIMUM IN, mounting_method: PRESS FIT, overall_diameter: 0.123 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, terminal_type_and_quantity: 2 UNINSULATED WIRE LEAD. This part is cataloged in the U.S.

Government catalog under NSN 5961-00-458-9488, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
HP0300
NSN: 5961-00-458-9488
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 50434 — AVAGO TECHNOLOGIES US INC DIV AVAGO TECHNOLOGIES (USA)
SPECIFICATIONS
materialSILICON SEMICONDUCTOR
overall_length0.212 INCHES MAXIMUM IN
mounting_methodPRESS FIT
overall_diameter0.123 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED CASE
terminal_type_and_quantity2 UNINSULATED WIRE LEAD
power_rating_per_characteristic2.0 WATTS MINIMUM TOTAL POWER DISSIPATION
capacitance_rating_in_picofarads4.7 MAXIMUM
current_rating_per_characteristic10.00 MICROAMPERES MAXIMUM REVERSE CURRENT, DC
voltage_rating_in_volts_per_characteristic100.0 MAXIMUM BREAKDOWN VOLTAGE, DC
maximum_operating_temp_per_measurement_point200.0 CELSIUS JUNCTION DEGC
NSN5961-00-458-9488
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN HP0300 MFR OEM SEMICONDUCTOR DEVICE,DIODE
KEY FEATURES
•
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 100.0 MAXIMUM BREAKDOWN VOLTAGE, DC
•
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 200.0 CELSIUS JUNCTION DEGC
•
OVERALL DIAMETER: 0.123 INCHES MAXIMUM IN
•
MOUNTING METHOD: PRESS FIT
•
FEATURES PROVIDED: HERMETICALLY SEALED CASE
•
CAPACITANCE RATING IN PICOFARADS: 4.7 MAXIMUM
•
CURRENT RATING PER CHARACTERISTIC: 10.00 MICROAMPERES MAXIMUM REVERSE CURRENT, DC
TECHNICAL CHARACTERISTICS
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC100.0 MAXIMUM BREAKDOWN VOLTAGE, DC
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT200.0 CELSIUS JUNCTION DEGC
OVERALL DIAMETER0.123 INCHES MAXIMUM IN
MOUNTING METHODPRESS FIT
OVERALL LENGTH0.212 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED CASE
CAPACITANCE RATING IN PICOFARADS4.7 MAXIMUM
CURRENT RATING PER CHARACTERISTIC10.00 MICROAMPERES MAXIMUM REVERSE CURRENT, DC
MATERIALSILICON SEMICONDUCTOR
MATERIALCERAMIC ENCLOSURE
OTHER ITEMS IN FSC 5961 — Semiconductor Devices and Associated Hardware
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5961-00-000-0150 5961-00-000-4541 5961-00-000-5400 5961-00-000-7614 5961-00-000-8760 5961-00-001-1352 5961-00-001-2624 5961-00-001-2978
SUBSTITUTES & CROSS-REFERENCES 1
5082-0300Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — stock exhausted; no further procurementNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is HP0300?
HP0300 is a SEMICONDUCTOR DEVICE,DIODE.
What parts can replace HP0300?
There is 1 known substitute for HP0300: 5082-0300. Substitute compatibility should be verified for your specific system.
What is the NSN for HP0300?
HP0300 is cataloged in the U.S. Government catalog under NSN 5961-00-458-9488. This indicates validated use in U.S. government and defense supply chains.
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