5082-0300: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.212 INCHES MAXIMUM IN, mounting_method: PRESS FIT, overall_diameter: 0.123 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, terminal_type_and_quantity: 2 UNINSULATED WIRE LEAD. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-458-9488, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.212 INCHES MAXIMUM IN |
| mounting_method | PRESS FIT |
| overall_diameter | 0.123 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 2.0 WATTS MINIMUM TOTAL POWER DISSIPATION |
| capacitance_rating_in_picofarads | 4.7 MAXIMUM |
| current_rating_per_characteristic | 10.00 MICROAMPERES MAXIMUM REVERSE CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 100.0 MAXIMUM BREAKDOWN VOLTAGE, DC |
| maximum_operating_temp_per_measurement_point | 200.0 CELSIUS JUNCTION DEGC |
| NSN | 5961-00-458-9488 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM BREAKDOWN VOLTAGE, DC |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS JUNCTION DEGC |
| OVERALL DIAMETER | 0.123 INCHES MAXIMUM IN |
| MOUNTING METHOD | PRESS FIT |
| OVERALL LENGTH | 0.212 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CAPACITANCE RATING IN PICOFARADS | 4.7 MAXIMUM |
| CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES MAXIMUM REVERSE CURRENT, DC |
| MATERIAL | SILICON SEMICONDUCTOR |
| MATERIAL | CERAMIC ENCLOSURE |