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HM9-041-2 — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

HM9-041-2: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.260 INCHES MAXIMUM IN, body_height: 0.045 INCHES MAXIMUM IN, body_length: 0.260 INCHES MAXIMUM IN, overall_width: 0.740 INCHES MINIMUM IN, features_provided: MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-245-3124, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
HM9-041-2
NSN: 5962-00-245-3124
NIINs: 002453124, 002453125, 002453126, 002453138, 002453149, 002453160, 002453161
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)
SPECIFICATIONS
body_width0.260 INCHES MAXIMUM IN
body_height0.045 INCHES MAXIMUM IN
body_length0.260 INCHES MAXIMUM IN
overall_width0.740 INCHES MINIMUM IN
features_providedMONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern8 INPUT
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
NSN5962-00-245-3124
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN HM9-041-2 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 8 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
DESIGN FUNCTION AND QUANTITY: 1 MATRIX, GENERAL PURPOSE
•
BODY WIDTH: 0.260 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.045 INCHES MAXIMUM IN
•
FEATURES PROVIDED: DIELECTRIC ISOLATED AND HERMETICALLY SEALED AND MONOLITHIC
•
INCLOSURE CONFIGURATION: FLAT PACK
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN8 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
DESIGN FUNCTION AND QUANTITY1 MATRIX, GENERAL PURPOSE
BODY WIDTH0.260 INCHES MAXIMUM IN
BODY HEIGHT0.045 INCHES MAXIMUM IN
FEATURES PROVIDEDDIELECTRIC ISOLATED AND HERMETICALLY SEALED AND MONOLITHIC
INCLOSURE CONFIGURATIONFLAT PACK
BODY LENGTH0.260 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 3
RM9-041-2Reference document
Same NSN cross-reference
Reference document — Secondary reference
619128-2Reference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROM FAMILY 058Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is HM9-041-2?
HM9-041-2 is a MICROCIRCUIT,DIGITAL.
What parts can replace HM9-041-2?
There are 3 known substitutes for HM9-041-2: RM9-041-2, 619128-2, ROM/PROM FAMILY 058. Substitute compatibility should be verified for your specific system.
What is the NSN for HM9-041-2?
HM9-041-2 is cataloged in the U.S. Government catalog under NSN 5962-00-245-3124. This indicates validated use in U.S. government and defense supply chains.
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