ROM/PROM FAMILY 058: SEMICONDUCTOR DEVICES,UNITIZED.
The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include body_width: 0.260 INCHES MAXIMUM IN, body_height: 0.035 INCHES MINIMUM AND 0.045 INCHES MAXIMUM IN, body_length: 0.260 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND MEDIUM POWER, output_logic_form: CURRENT-MODE LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.
Government catalog under NSN 5962-00-001-1910, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.260 INCHES MAXIMUM IN |
| body_height | 0.035 INCHES MINIMUM AND 0.045 INCHES MAXIMUM IN |
| body_length | 0.260 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED AND MEDIUM POWER |
| output_logic_form | CURRENT-MODE LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| memory_device_type | DIODE MATRIX |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-00-001-1910 |
| INPUT CIRCUIT PATTERN | 6 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.260 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.040 INCHES NOMINAL IN |
| FEATURES PROVIDED | MONOLITHIC AND MEDIUM POWER AND HERMETICALLY SEALED |
| INCLOSURE CONFIGURATION | FLAT PACK |
| MEMORY DEVICE TYPE | DIODE MATRIX |
| BODY LENGTH | 0.260 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |