HD63701V0C/883 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HD63701V0C/883: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED AND ERASABLE, inclosure_material: CERAMIC, memory_device_type: EPROM, storage_temp_range: -55.0 TO 150.0 CELSIUS DEGC, operating_temp_range: +0.0 TO 70.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-319-0344, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HD63701V0C/883

NSN: 5962-01-319-0344
FSC: 5962 — Microcircuits, Electronic
CAGE: 62786 — HITACHI AMERICA LTD DBA HITACHI COMPUTER PRODUCTS AMERICA INC (USA)

SPECIFICATIONS

features_provided	PROGRAMMED AND ERASABLE
inclosure_material	CERAMIC
memory_device_type	EPROM
storage_temp_range	-55.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
voltage_rating_and_type_per_characteristic	-0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
NSN	5962-01-319-0344

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: PROGRAMMED AND ERASABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: EPROM

•

STORAGE TEMP RANGE: -55.0 TO 150.0 CELSIUS DEGC

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

•

OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	PROGRAMMED AND ERASABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	EPROM
STORAGE TEMP RANGE	-55.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	+0.0 TO 70.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY	40 PRINTED CIRCUIT

SUBSTITUTES & CROSS-REFERENCES 3

107468-002Reference document

Same NSN cross-reference

Reference document — Secondary reference

107745-013Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is HD63701V0C/883?

HD63701V0C/883 is a MICROCIRCUIT,MEMORY.

What parts can replace HD63701V0C/883?

There are 3 known substitutes for HD63701V0C/883: 107468-002, 107745-013, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for HD63701V0C/883?

HD63701V0C/883 is cataloged in the U.S. Government catalog under NSN 5962-01-319-0344. This indicates validated use in U.S. government and defense supply chains.

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