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107468-002 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

107468-002: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PROGRAMMED, storage_temp_range: -55.0 TO 150.0 CELSIUS DEGC, operating_temp_range: +0.0 TO 70.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-319-0344, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
107468-002
NSN: 5962-01-319-0344
NIINs: 013190344, 013467591
FSC: 5962 — Microcircuits, Electronic
CAGE: 058R3 — GE AVIATION SYSTEMS LLC DBA GE AVIATION (USA)
SPECIFICATIONS
features_providedPROGRAMMED
inclosure_materialCERAMIC
memory_device_typePROGRAMMED
storage_temp_range-55.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
voltage_rating_and_type_per_characteristic-0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-319-0344
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 107468-002 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
FEATURES PROVIDED: PROGRAMMED AND ERASABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: EPROM
•
STORAGE TEMP RANGE: -55.0 TO 150.0 CELSIUS DEGC
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
•
OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
FEATURES PROVIDEDPROGRAMMED AND ERASABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEEPROM
STORAGE TEMP RANGE-55.0 TO 150.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.3 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE+0.0 TO 70.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY40 PRINTED CIRCUIT
SUBSTITUTES & CROSS-REFERENCES 3
HD63701V0C/883Reference document
Same NSN cross-reference
Reference document — Secondary reference
107745-013Reference document
Same NSN cross-reference
Reference document — Design control — primary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 107468-002?
107468-002 is a MICROCIRCUIT,MEMORY.
What parts can replace 107468-002?
There are 3 known substitutes for 107468-002: HD63701V0C/883, 107745-013, ROM/PROM. Substitute compatibility should be verified for your specific system.
What is the NSN for 107468-002?
107468-002 is cataloged in the U.S. Government catalog under NSN 5962-01-319-0344. This indicates validated use in U.S. government and defense supply chains.
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