Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: GM820ARH1NR3

GM820ARH1NR3 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.160 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, features_provided: SCHOTTKY AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND PROGRAMMABLE AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-264-9031, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

GM820ARH1NR3

NSN: 5962-01-264-9031
FSC: 5962
CAGE: 26512 — NORTHROP GRUMMAN SYSTEMS CORPORATION (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.160 INCHES MAXIMUM IN
body_length	0.785 INCHES MAXIMUM IN
features_provided	SCHOTTKY AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND PROGRAMMABLE AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-264-9031

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

•

TIME RATING PER CHACTERISTIC: 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

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TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT

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TERMINAL SURFACE TREATMENT: SOLDER

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INPUT CIRCUIT PATTERN	6 INPUT
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
TIME RATING PER CHACTERISTIC	40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL TYPE AND QUANTITY	16 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT	SOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.785 INCHES MAXIMUM IN
BODY HEIGHT	0.160 INCHES MAXIMUM IN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 10

802986-1Interchangeable