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G104670-834 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

G104670-834: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.450 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.550 INCHES MAXIMUM IN, features_provided: PROGRAMMED, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-257-8346, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
G104670-834
NSN: 5962-01-257-8346
NIINs: 012578346, 014139965, 014139966, 014139967, 014139971, 014139973, 014139974, 014139976, 014139977, 014139979, 014139980, 014139986, 014139989, 014139991, 014139992, 014139994, 014139995, 014139996, 014139997, 014139998, 014139999, 014140000, 014140001, 014140002, 014140003, 014140004, 014140005, 014140006, 014140010
FSC: 5962 — Microcircuits, Electronic
CAGE: 49956 — RAYTHEON COMPANY DIV CORP (USA)
SPECIFICATIONS
body_width0.450 INCHES MAXIMUM IN
body_height0.120 INCHES MAXIMUM IN
body_length0.550 INCHES MAXIMUM IN
features_providedPROGRAMMED
output_logic_formMETAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationLEADLESS FLAT PACK
terminal_surface_treatmentSOLDER
NSN5962-01-257-8346
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN G104670-834 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.450 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.120 INCHES MAXIMUM IN
•
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN14 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.450 INCHES MAXIMUM IN
BODY HEIGHT0.120 INCHES MAXIMUM IN
FEATURES PROVIDEDELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND PROGRAMMABLE
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPEROM
BODY LENGTH0.550 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 4
AM27S191A/LMCReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROM HEAD 108Reference document
Same NSN cross-reference
Reference document — Secondary reference
AM27S191A/BUAReference document
Same NSN cross-reference
Reference document — Secondary reference
8505758-791Reference document
Same NSN cross-reference
Reference document — Design control — primary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is G104670-834?
G104670-834 is a MICROCIRCUIT,MEMORY.
What parts can replace G104670-834?
There are 4 known substitutes for G104670-834: AM27S191A/LMC, ROM/PROM HEAD 108, AM27S191A/BUA and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for G104670-834?
G104670-834 is cataloged in the U.S. Government catalog under NSN 5962-01-257-8346. This indicates validated use in U.S. government and defense supply chains.
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