8505758-791 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8505758-791: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.450 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.550 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND PROGRAMMABLE, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-257-8346, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8505758-791

NSN: 5962-01-257-8346
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)

SPECIFICATIONS

body_width	0.450 INCHES MAXIMUM IN
body_height	0.120 INCHES MAXIMUM IN
body_length	0.550 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND PROGRAMMABLE
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-257-8346

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.450 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.120 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.450 INCHES MAXIMUM IN
BODY HEIGHT	0.120 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND 3-STATE OUTPUT AND PROGRAMMABLE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.550 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

AM27S191A/LMCReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM HEAD 108Reference document

Same NSN cross-reference

Reference document — Secondary reference

G104670-834Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

AM27S191A/BUAReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 8505758-791?

8505758-791 is a MICROCIRCUIT,MEMORY.

What parts can replace 8505758-791?

There are 4 known substitutes for 8505758-791: AM27S191A/LMC, ROM/PROM HEAD 108, G104670-834 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 8505758-791?

8505758-791 is cataloged in the U.S. Government catalog under NSN 5962-01-257-8346. This indicates validated use in U.S. government and defense supply chains.

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