EP600DMB: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.155 INCHES MAXIMUM IN, body_length: 0.460 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND HIGH PERFORMANCE AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-341-5883, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.155 INCHES MAXIMUM IN |
| body_length | 0.460 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND HIGH PERFORMANCE AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 22 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-341-5883 |
| INPUT CIRCUIT PATTERN | 22 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND HIGH PERFORMANCE AND MONOLITHIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 4.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | PAL |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |