The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.250 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, overall_length: 1.280 INCHES MAXIMUM IN, special_features: PROGRAMMED. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-294-0079, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 1.250 INCHES MAXIMUM IN |
| overall_height | 0.400 INCHES MAXIMUM IN |
| overall_length | 1.280 INCHES MAXIMUM IN |
| special_features | PROGRAMMED |
| features_provided | ULTRAVIOLET ERASABLE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| NSN | 5962-01-294-0079 |
| FEATURES PROVIDED | PROGRAMMED AND ULTRAVIOLET ERASABLE |
| DESIGN FUNCTION AND QUANTITY | 1 ARRAY, LOGIC |
| INCLOSURE CONFIGURATION | FLAT PACK |