EP1800JMB: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.960 INCHES MAXIMUM IN, body_height: 0.155 INCHES MAXIMUM IN, body_length: 0.960 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-291-5582, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.960 INCHES MAXIMUM IN |
| body_height | 0.155 INCHES MAXIMUM IN |
| body_length | 0.960 INCHES MAXIMUM IN |
| features_provided | ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 60 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-291-5582 |
| INPUT CIRCUIT PATTERN | 60 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 ARRAY, LOGIC |
| BODY WIDTH | 0.960 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.155 INCHES MAXIMUM IN |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND MONOLITHIC |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| BODY LENGTH | 0.960 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |