EP1800JM883B — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

EP1800JM883B: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.960 INCHES MAXIMUM IN, body_height: 0.155 INCHES MAXIMUM IN, body_length: 0.960 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-291-5582, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

EP1800JM883B

NSN: 5962-01-291-5582
FSC: 5962 — Microcircuits, Electronic
CAGE: 67183 — ALTERA CORP (USA)

SPECIFICATIONS

body_width	0.960 INCHES MAXIMUM IN
body_height	0.155 INCHES MAXIMUM IN
body_length	0.960 INCHES MAXIMUM IN
features_provided	ELECTROSTATIC SENSITIVE AND MONOLITHIC
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	60 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-291-5582

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 60 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 ARRAY, LOGIC

•

BODY WIDTH: 0.960 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.155 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND MONOLITHIC

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	60 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 ARRAY, LOGIC
BODY WIDTH	0.960 INCHES MAXIMUM IN
BODY HEIGHT	0.155 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE AND MONOLITHIC
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
BODY LENGTH	0.960 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

8511821-700Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

EP1800JMBSame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is EP1800JM883B?

EP1800JM883B is a MICROCIRCUIT,DIGITAL.

What parts can replace EP1800JM883B?

There are 3 known substitutes for EP1800JM883B: 8511821-700, ROM/PROM, EP1800JMB. Substitute compatibility should be verified for your specific system.

What is the NSN for EP1800JM883B?

EP1800JM883B is cataloged in the U.S. Government catalog under NSN 5962-01-291-5582. This indicates validated use in U.S. government and defense supply chains.

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EP1800JM883B — MICROCIRCUIT,DIGITAL

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