EDH8808AC-10LPJMHR — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

EDH8808AC-10LPJMHR: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.458 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.560 INCHES MAXIMUM IN, bit_quantity: 65536, word_quantity: 8192, features_provided: MONOLITHIC AND STATIC OPERATION. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-260-8677, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

EDH8808AC-10LPJMHR

NSN: 5962-01-260-8677
FSC: 5962 — Microcircuits, Electronic
CAGE: 66301 — WHITE ELECTRONIC DESIGNS CORP DIV COMMERCIAL DIVISION (USA)

SPECIFICATIONS

body_width	0.458 INCHES MAXIMUM IN
body_height	0.120 INCHES MAXIMUM IN
body_length	0.560 INCHES MAXIMUM IN
bit_quantity	65536
word_quantity	8192
features_provided	MONOLITHIC AND STATIC OPERATION
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-260-8677

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 65536

•

INPUT CIRCUIT PATTERN: 21 INPUT

•

WORD QUANTITY: 8192

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.458 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.120 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND STATIC OPERATION

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	65536
INPUT CIRCUIT PATTERN	21 INPUT
WORD QUANTITY	8192
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.458 INCHES MAXIMUM IN
BODY HEIGHT	0.120 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND STATIC OPERATION
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
CURRENT RATING PER CHARACTERISTIC	80.00 MILLIAMPERES MAXIMUM SUPPLY

SUBSTITUTES & CROSS-REFERENCES 8

0W5077Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

IDT7164S85LBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8552503YAReference document

Same NSN cross-reference

Reference document — Secondary reference

795100-1Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

5962-8552503YXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-3829405MYBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is EDH8808AC-10LPJMHR?

EDH8808AC-10LPJMHR is a MICROCIRCUIT,MEMORY.

What parts can replace EDH8808AC-10LPJMHR?

There are 8 known substitutes for EDH8808AC-10LPJMHR: 0W5077, IDT7164S85LB, 5962-8552503YA and 5 more. Substitute compatibility should be verified for your specific system.

What is the NSN for EDH8808AC-10LPJMHR?

EDH8808AC-10LPJMHR is cataloged in the U.S. Government catalog under NSN 5962-01-260-8677. This indicates validated use in U.S. government and defense supply chains.

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