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5962-3829405MYB — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

5962-3829405MYB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.458 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.560 INCHES MAXIMUM IN, bit_quantity: 65536, word_quantity: 8192, features_provided: MONOLITHIC AND STATIC OPERATION. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-260-8677, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5962-3829405MYB
NSN: 5962-01-260-8677
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.458 INCHES MAXIMUM IN
body_height0.120 INCHES MAXIMUM IN
body_length0.560 INCHES MAXIMUM IN
bit_quantity65536
word_quantity8192
features_providedMONOLITHIC AND STATIC OPERATION
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-260-8677
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5962-3829405MYB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BIT QUANTITY: 65536
•
INPUT CIRCUIT PATTERN: 21 INPUT
•
WORD QUANTITY: 8192
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.458 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.120 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND STATIC OPERATION
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
BIT QUANTITY65536
INPUT CIRCUIT PATTERN21 INPUT
WORD QUANTITY8192
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.458 INCHES MAXIMUM IN
BODY HEIGHT0.120 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND STATIC OPERATION
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CURRENT RATING PER CHARACTERISTIC80.00 MILLIAMPERES MAXIMUM SUPPLY
SUBSTITUTES & CROSS-REFERENCES 8
EDH8808AC-10LPJMHRReference document
Same NSN cross-reference
Reference document — Secondary reference
0W5077Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
IDT7164S85LBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8552503YAReference document
Same NSN cross-reference
Reference document — Secondary reference
795100-1Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
5962-8552503YXReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusCancelled· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 5962-3829405MYB?
5962-3829405MYB is a MICROCIRCUIT,MEMORY.
What parts can replace 5962-3829405MYB?
There are 8 known substitutes for 5962-3829405MYB: EDH8808AC-10LPJMHR, 0W5077, IDT7164S85LB and 5 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5962-3829405MYB?
5962-3829405MYB is cataloged in the U.S. Government catalog under NSN 5962-01-260-8677. This indicates validated use in U.S. government and defense supply chains.
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