DMS 85076B: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM IN, body_height: 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN, body_length: 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN, overall_height: 0.330 INCHES NOMINAL IN, special_features: WITH COMMON CLOCK, features_provided: HERMETICALLY SEALED AND BURN IN AND W/TOTEM POLE OUTPUT AND BIPOLAR AND HIGH PERFORMANCE AND POSITIVE OUTPUTS. This part is cataloged in the U.S.
Government catalog under NSN 5962-00-137-5060, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM IN |
| body_height | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM IN |
| body_length | 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM IN |
| overall_height | 0.330 INCHES NOMINAL IN |
| special_features | WITH COMMON CLOCK |
| features_provided | HERMETICALLY SEALED AND BURN IN AND W/TOTEM POLE OUTPUT AND BIPOLAR AND HIGH PERFORMANCE AND POSITIVE OUTPUTS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| precious_material | GOLD |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-00-137-5060 |
| INPUT CIRCUIT PATTERN | DUAL 2 WIDE 2-3 INPUT |
| INCLOSURE MATERIAL | GLASS AND METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| PRECIOUS MATERIAL | GOLD |
| DESIGN FUNCTION AND QUANTITY | 2 GATE, AND-OR INVERT |
| BODY WIDTH | 0.140 INCHES MINIMUM AND 0.150 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.035 INCHES MINIMUM AND 0.050 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER AND W/TOTEM POLE OUTPUT |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-84 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |