DAC-HZMM-QL — MICROCIRCUIT,HYBRID

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

DAC-HZMM-QL: MICROCIRCUIT,HYBRID.

The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 0.800 INCHES NOMINAL IN, body_height: 0.160 INCHES NOMINAL IN, body_length: 1.300 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND HYBRID AND HIGH PERFORMANCE, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-176-6679, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

DAC-HZMM-QL

NSN: 5962-01-176-6679
FSC: 5962 — Microcircuits, Electronic
CAGE: 50721 — DATEL, INC. (USA)

SPECIFICATIONS

body_width	0.800 INCHES NOMINAL IN
body_height	0.160 INCHES NOMINAL IN
body_length	1.300 INCHES NOMINAL IN
features_provided	HERMETICALLY SEALED AND HYBRID AND HIGH PERFORMANCE
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
hybrid_technology_type	FILM AND MULTICHIP
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-176-6679

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: FILM AND MULTICHIP

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 CONVERTER, DIGITAL TO ANALOG

•

BODY WIDTH: 0.800 INCHES NOMINAL IN

•

BODY HEIGHT: 0.160 INCHES NOMINAL IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND HYBRID AND HIGH PERFORMANCE

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	FILM AND MULTICHIP
INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 CONVERTER, DIGITAL TO ANALOG
BODY WIDTH	0.800 INCHES NOMINAL IN
BODY HEIGHT	0.160 INCHES NOMINAL IN
FEATURES PROVIDED	HERMETICALLY SEALED AND HYBRID AND HIGH PERFORMANCE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	35.00 MILLIAMPERES NOMINAL SUPPLY

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

DAC-HZB/883B-21381Reference document

Same NSN cross-reference

Reference document — Secondary reference

13084374Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is DAC-HZMM-QL?

DAC-HZMM-QL is a MICROCIRCUIT,HYBRID.

What parts can replace DAC-HZMM-QL?

There are 2 known substitutes for DAC-HZMM-QL: DAC-HZB/883B-21381, 13084374. Substitute compatibility should be verified for your specific system.

What is the NSN for DAC-HZMM-QL?

DAC-HZMM-QL is cataloged in the U.S. Government catalog under NSN 5962-01-176-6679. This indicates validated use in U.S. government and defense supply chains.

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