DAC-HZB/883B-21381: MICROCIRCUIT,HYBRID.
The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 0.800 INCHES NOMINAL IN, body_height: 0.160 INCHES NOMINAL IN, body_length: 1.300 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND HYBRID AND HIGH PERFORMANCE, inclosure_material: CERAMIC AND GLASS, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-176-6679, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.800 INCHES NOMINAL IN |
| body_height | 0.160 INCHES NOMINAL IN |
| body_length | 1.300 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED AND HYBRID AND HIGH PERFORMANCE |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 12 INPUT |
| hybrid_technology_type | FILM AND MULTICHIP |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-176-6679 |
| HYBRID TECHNOLOGY TYPE | FILM AND MULTICHIP |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 CONVERTER, DIGITAL TO ANALOG |
| BODY WIDTH | 0.800 INCHES NOMINAL IN |
| BODY HEIGHT | 0.160 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND HYBRID AND HIGH PERFORMANCE |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 35.00 MILLIAMPERES NOMINAL SUPPLY |