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Technical Data Sheet
CN8082AN ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.568 INCHES MINIMUM AND 0.598 INCHES MAXIMUM IN, body_height: 0.040 INCHES MINIMUM AND 0.162 INCHES MAXIMUM IN, body_length: 1.188 INCHES MINIMUM AND 1.212 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 2048, features_provided: HIGH SPEED AND HIGH PERFORMANCE AND STATIC OPERATION AND HERMETICALLY SEALED. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-155-8001, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
CN8082AN
NSN: 5962-01-155-8001
FSC: 5962
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.568 INCHES MINIMUM AND 0.598 INCHES MAXIMUM IN
body_height0.040 INCHES MINIMUM AND 0.162 INCHES MAXIMUM IN
body_length1.188 INCHES MINIMUM AND 1.212 INCHES MAXIMUM IN
bit_quantity16384
word_quantity2048
features_providedHIGH SPEED AND HIGH PERFORMANCE AND STATIC OPERATION AND HERMETICALLY SEALED
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern13 INPUT
NSN5962-01-155-8001
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN CN8082AN MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
FEATURES PROVIDED: HIGH SPEED AND HIGH PERFORMANCE AND STATIC OPERATION AND HERMETICALLY SEALED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TERMINAL SURFACE TREATMENT: SOLDER
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
BIT QUANTITY: 16384
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
TECHNICAL CHARACTERISTICS (FLIS)
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
OUTPUT LOGIC FORMN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
FEATURES PROVIDEDHIGH SPEED AND HIGH PERFORMANCE AND STATIC OPERATION AND HERMETICALLY SEALED
INCLOSURE CONFIGURATIONDUAL-IN-LINE
TERMINAL SURFACE TREATMENTSOLDER
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
BIT QUANTITY16384
MAXIMUM POWER DISSIPATION RATING1.0 WATTS
INCLOSURE MATERIALCERAMIC AND GLASS
BODY HEIGHT0.040 INCHES MINIMUM AND 0.162 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 17
1818-0513Interchangeable
interchangeable cross-reference
interchangeable
2617FMASKEDInterchangeable
interchangeable cross-reference
interchangeable
DMS 86003BInterchangeable
interchangeable cross-reference
interchangeable
5013416Interchangeable
interchangeable cross-reference
interchangeable
SMJ2708-45JLInterchangeable
interchangeable cross-reference
interchangeable
1818-0208Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is CN8082AN?
CN8082AN is a MICROCIRCUIT,DIGITAL.
What parts can replace CN8082AN?
There are 17 known substitutes for CN8082AN: 1818-0513, 2617FMASKED, DMS 86003B and 14 more. Substitute compatibility should be verified for your specific system.
What is the NSN for CN8082AN?
CN8082AN is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-155-8001. This indicates validated use in U.S. government and defense supply chains.
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