1818-0208 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

1818-0208: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 1.230 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED AND 3-STATE OUTPUT, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-109-2425, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

1818-0208

NSN: 5962-01-109-2425
FSC: 5962 — Microcircuits, Electronic
CAGE: 7ZXR5 — KEYSIGHT TECHNOLOGIES INC (USA)

SPECIFICATIONS

body_width	0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
body_height	0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length	1.230 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED AND 3-STATE OUTPUT
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	13 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-109-2425

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 13 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	13 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.580 INCHES MINIMUM AND 0.620 INCHES MAXIMUM IN
BODY HEIGHT	0.150 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.230 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

AM9216BDCReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

N2617FReference document

Same NSN cross-reference

Reference document — Secondary reference

DMS 86003BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 1818-0208?

1818-0208 is a MICROCIRCUIT,DIGITAL.

What parts can replace 1818-0208?

There are 4 known substitutes for 1818-0208: AM9216BDC, ROM/PROM, N2617F and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 1818-0208?

1818-0208 is cataloged in the U.S. Government catalog under NSN 5962-01-109-2425. This indicates validated use in U.S. government and defense supply chains.

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