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AM27S80DC — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

AM27S80DC: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.525 INCHES MINIMUM AND 0.535 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: PROGRAMMABLE AND W/ENABLE AND W/OPEN COLLECTOR AND HERMETICALLY SEALED AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-128-6922, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
AM27S80DC
NSN: 5962-01-128-6922
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)
SPECIFICATIONS
body_width0.525 INCHES MINIMUM AND 0.535 INCHES MAXIMUM IN
body_height0.180 INCHES MAXIMUM IN
body_length1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedPROGRAMMABLE AND W/ENABLE AND W/OPEN COLLECTOR AND HERMETICALLY SEALED AND POSITIVE OUTPUTS
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
end_item_identification02-1252038-1 07397
NSN5962-01-128-6922
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN AM27S80DC MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.525 INCHES MINIMUM AND 0.535 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.180 INCHES MAXIMUM IN
•
FEATURES PROVIDED: PROGRAMMABLE AND W/ENABLE AND W/OPEN COLLECTOR AND HERMETICALLY SEALED AND POSITIVE OUTPUTS
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN14 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.525 INCHES MINIMUM AND 0.535 INCHES MAXIMUM IN
BODY HEIGHT0.180 INCHES MAXIMUM IN
FEATURES PROVIDEDPROGRAMMABLE AND W/ENABLE AND W/OPEN COLLECTOR AND HERMETICALLY SEALED AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 3
1816-1417Reference document
Same NSN cross-reference
Reference document — Design control — primary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
6380-1JReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is AM27S80DC?
AM27S80DC is a MICROCIRCUIT,MEMORY.
What parts can replace AM27S80DC?
There are 3 known substitutes for AM27S80DC: 1816-1417, ROM/PROM, 6380-1J. Substitute compatibility should be verified for your specific system.
What is the NSN for AM27S80DC?
AM27S80DC is cataloged in the U.S. Government catalog under NSN 5962-01-128-6922. This indicates validated use in U.S. government and defense supply chains.
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