6380-1J — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

6380-1J: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.510 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN, body_height: 0.155 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN, body_length: 1.250 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND POSITIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND W/OPEN COLLECTOR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-103-8163, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

6380-1J

NSN: 5962-01-103-8163
NIINs: 011038163, 011286922
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.510 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN
body_height	0.155 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN
body_length	1.250 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND POSITIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND W/OPEN COLLECTOR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
end_item_identification	02-1252038-1 07397
NSN	5962-01-103-8163

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.510 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.155 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND POSITIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND W/OPEN COLLECTOR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.510 INCHES MINIMUM AND 0.550 INCHES MAXIMUM IN
BODY HEIGHT	0.155 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND POSITIVE OUTPUTS AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND W/OPEN COLLECTOR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.250 INCHES MINIMUM AND 1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 6380-1J?

6380-1J is a MICROCIRCUIT,MEMORY.

What is the NSN for 6380-1J?

6380-1J is cataloged in the U.S. Government catalog under NSN 5962-01-103-8163. This indicates validated use in U.S. government and defense supply chains.

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6380-1J — MICROCIRCUIT,MEMORY

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