AM27S35DMB: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN, body_height: 0.090 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN, body_length: 1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN, bit_quantity: 8192, word_quantity: 1024, memory_capacity: UNKNOWN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-228-9816, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN |
| body_height | 0.090 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| body_length | 1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN |
| bit_quantity | 8192 |
| word_quantity | 1024 |
| memory_capacity | UNKNOWN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR AND HIGH PERFORMANCE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| NSN | 5962-01-228-9816 |
| INPUT CIRCUIT PATTERN | 14 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.135 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND HIGH PERFORMANCE AND ASYNCHRONOUS AND SCHOTTKY |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |