314096P1 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

314096P1: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN, body_height: 0.135 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN, body_length: 1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN, bit_quantity: 8192, word_quantity: 1024, features_provided: HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND HIGH PERFORMANCE AND ASYNCHRONOUS AND SCHOTTKY. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-228-9816, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

314096P1

NSN: 5962-01-228-9816
NIINs: 012289816, 012289817, 012289818, 012289819, 012289820, 012290807, 012290808, 012290809, 012290810, 012412138
FSC: 5962 — Microcircuits, Electronic
CAGE: 94117 — BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. DBA BAE SYSTEMS (USA)

SPECIFICATIONS

body_width	0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN
body_height	0.135 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN
body_length	1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
bit_quantity	8192
word_quantity	1024
features_provided	HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND HIGH PERFORMANCE AND ASYNCHRONOUS AND SCHOTTKY
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-228-9816

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.135 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND HIGH PERFORMANCE AND ASYNCHRONOUS AND SCHOTTKY

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.510 INCHES MINIMUM AND 0.545 INCHES MAXIMUM IN
BODY HEIGHT	0.135 INCHES MINIMUM AND 0.165 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND HIGH PERFORMANCE AND ASYNCHRONOUS AND SCHOTTKY
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 088Reference document

Same NSN cross-reference

Reference document — Secondary reference

AM27S35DMBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 314096P1?

314096P1 is a MICROCIRCUIT,DIGITAL.

What parts can replace 314096P1?

There are 2 known substitutes for 314096P1: ROM/PROM FAMILY 088, AM27S35DMB. Substitute compatibility should be verified for your specific system.

What is the NSN for 314096P1?

314096P1 is cataloged in the U.S. Government catalog under NSN 5962-01-228-9816. This indicates validated use in U.S. government and defense supply chains.

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314096P1 — MICROCIRCUIT,DIGITAL

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