The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include diameter: 0.334 INCHES MINIMUM AND 0.354 INCHES MAXIMUM IN, material: COPPER ALLOY BODY, slot_width: 0.340 INCHES NOMINAL IN, slot_length: 0.460 INCHES NOMINAL IN, overall_width: 0.870 INCHES MINIMUM AND 0.890 INCHES MAXIMUM IN, connection_type: UNTHREADED INTERNAL TUBE SECOND END. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-271-4833, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| diameter | 0.334 INCHES MINIMUM AND 0.354 INCHES MAXIMUM IN |
| material | COPPER ALLOY BODY |
| slot_width | 0.340 INCHES NOMINAL IN |
| slot_length | 0.460 INCHES NOMINAL IN |
| overall_width | 0.870 INCHES MINIMUM AND 0.890 INCHES MAXIMUM IN |
| connection_type | UNTHREADED INTERNAL TUBE SECOND END |
| mounting_method | THREADED STUD(S) |
| connection_style | PLAIN (TUBE) SECOND END |
| style_designator | ANGLE |
| thread_direction | RIGHT-HAND FIRST END |
| features_provided | HERMETICALLY SEALED CASE |
| material_thickness | 0.089 INCHES MINIMUM AND 0.091 INCHES MAXIMUM IN |
| NSN | 5961-00-271-4833 |
| TERMINAL TYPE AND QUANTITY | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MOUNTING METHOD | THREADED STUD(S) |
| MATERIAL | SILICON SEMICONDUCTOR |