A5779 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

A5779: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.270 INCHES NOMINAL IN, body_height: 0.155 INCHES NOMINAL IN, body_length: 0.760 INCHES NOMINAL IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND HIGH SPEED AND SCHOTTKY AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-115-9971, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

A5779

NSN: 5962-01-115-9971
NIINs: 011159971, 014499811
FSC: 5962 — Microcircuits, Electronic
CAGE: 1PQF4 — CAE USA INC. (USA)

SPECIFICATIONS

body_width	0.270 INCHES NOMINAL IN
body_height	0.155 INCHES NOMINAL IN
body_length	0.760 INCHES NOMINAL IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND HIGH SPEED AND SCHOTTKY AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	6 INPUT
end_item_identification	CHINOOK CH-47D HELICOPTER
NSN	5962-01-115-9971

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.270 INCHES NOMINAL IN

•

BODY HEIGHT: 0.155 INCHES NOMINAL IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND HIGH SPEED AND SCHOTTKY AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.270 INCHES NOMINAL IN
BODY HEIGHT	0.155 INCHES NOMINAL IN
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND HIGH SPEED AND SCHOTTKY AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.760 INCHES NOMINAL IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROM FAMILY 013Reference document

Same NSN cross-reference

Reference document — Secondary reference

HM1-7603-5Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is A5779?

A5779 is a MICROCIRCUIT,MEMORY.

What parts can replace A5779?

There are 2 known substitutes for A5779: ROM/PROM FAMILY 013, HM1-7603-5. Substitute compatibility should be verified for your specific system.

What is the NSN for A5779?

A5779 is cataloged in the U.S. Government catalog under NSN 5962-01-115-9971. This indicates validated use in U.S. government and defense supply chains.

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