HM1-7603-5 — CARD,INTERGRATED CIRCUIT

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

HM1-7603-5: CARD,INTERGRATED CIRCUIT.

The CARD,INTERGRATED CIRCUIT is a the manufacturer industrial component. Key specifications include body_width: 0.270 INCHES NOMINAL IN, body_height: 0.175 INCHES NOMINAL IN, body_length: 0.760 INCHES NOMINAL IN, bit_quantity: 256, word_quantity: 32, overall_height: 0.400 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-079-5026, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

HM1-7603-5

NSN: 5962-01-079-5026
NIINs: 010795026, 010795027, 010824389, 011048731, 011107371, 011159966, 011159967, 011159968, 011159969, 011159970, 011159971, 011159972, 011159977, 011159981, 011159982, 011159984, 011159985, 011159986, 011159987, 011159988, 011159989, 011741382, 011741383, 011798615, 011901389, 011901390, 011901391, 012132278, 012543270, 012543300, 012569615, 012763977, 012763978, 012886901
FSC: 5962 — Microcircuits, Electronic
CAGE: 34371 — RENESAS ELECTRONICS AMERICA INC (USA)

SPECIFICATIONS

body_width	0.270 INCHES NOMINAL IN
body_height	0.175 INCHES NOMINAL IN
body_length	0.760 INCHES NOMINAL IN
bit_quantity	256
word_quantity	32
overall_height	0.400 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	3-STATE OUTPUT AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND HIGH SPEED AND BIPOLAR AND PROGRAMMED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
NSN	5962-01-079-5026

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 6 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.270 INCHES NOMINAL IN

•

BODY HEIGHT: 0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	6 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.270 INCHES NOMINAL IN
BODY HEIGHT	0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.750 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

4014533-001Reference document

Same NSN cross-reference

Reference document — Secondary reference

4014533-002Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is HM1-7603-5?

HM1-7603-5 is a CARD,INTERGRATED CIRCUIT.

What parts can replace HM1-7603-5?

There are 2 known substitutes for HM1-7603-5: 4014533-001, 4014533-002. Substitute compatibility should be verified for your specific system.

What is the NSN for HM1-7603-5?

HM1-7603-5 is cataloged in the U.S. Government catalog under NSN 5962-01-079-5026. This indicates validated use in U.S. government and defense supply chains.

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HM1-7603-5 — CARD,INTERGRATED CIRCUIT

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