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921297-01 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

921297-01: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.180 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN, body_length: 1.580 INCHES MINIMUM AND 1.620 INCHES MAXIMUM IN, bit_quantity: 1048576, word_quantity: 131072, features_provided: HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND HIGH SPEED AND W/ENABLE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-303-3554, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
921297-01
NSN: 5962-01-303-3554
FSC: 5962 — Microcircuits, Electronic
CAGE: 33827 — BAE SYSTEMS INTEGRATED DEFENSE SOLUTIONS INC. (USA)
SPECIFICATIONS
body_width0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height0.180 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN
body_length1.580 INCHES MINIMUM AND 1.620 INCHES MAXIMUM IN
bit_quantity1048576
word_quantity131072
features_providedHERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND HIGH SPEED AND W/ENABLE
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
NSN5962-01-303-3554
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 921297-01 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BIT QUANTITY: 1048576
•
INPUT CIRCUIT PATTERN: 28 INPUT
•
WORD QUANTITY: 131072
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.180 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND HIGH SPEED AND W/ENABLE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
BIT QUANTITY1048576
INPUT CIRCUIT PATTERN28 INPUT
WORD QUANTITY131072
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT0.180 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND HIGH SPEED AND W/ENABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 1
IDT8M824S70CBReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 921297-01?
921297-01 is a MICROCIRCUIT,MEMORY.
What parts can replace 921297-01?
There is 1 known substitute for 921297-01: IDT8M824S70CB. Substitute compatibility should be verified for your specific system.
What is the NSN for 921297-01?
921297-01 is cataloged in the U.S. Government catalog under NSN 5962-01-303-3554. This indicates validated use in U.S. government and defense supply chains.
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