IDT8M824S70CB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

IDT8M824S70CB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.180 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN, body_length: 1.580 INCHES MINIMUM AND 1.620 INCHES MAXIMUM IN, bit_quantity: 1048576, word_quantity: 131072, features_provided: HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND HIGH SPEED AND W/ENABLE. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-303-3554, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

IDT8M824S70CB

NSN: 5962-01-303-3554
FSC: 5962 — Microcircuits, Electronic
CAGE: 61772 — INTEGRATED DEVICE TECHNOLOGY INC (USA)

SPECIFICATIONS

body_width	0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.180 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN
body_length	1.580 INCHES MINIMUM AND 1.620 INCHES MAXIMUM IN
bit_quantity	1048576
word_quantity	131072
features_provided	HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND HIGH SPEED AND W/ENABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-303-3554

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 1048576

•

INPUT CIRCUIT PATTERN: 28 INPUT

•

WORD QUANTITY: 131072

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND HIGH SPEED AND W/ENABLE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	1048576
INPUT CIRCUIT PATTERN	28 INPUT
WORD QUANTITY	131072
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES MINIMUM AND 0.240 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND HIGH SPEED AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is IDT8M824S70CB?

IDT8M824S70CB is a MICROCIRCUIT,MEMORY.

What is the NSN for IDT8M824S70CB?

IDT8M824S70CB is cataloged in the U.S. Government catalog under NSN 5962-01-303-3554. This indicates validated use in U.S. government and defense supply chains.

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IDT8M824S70CB — MICROCIRCUIT,MEMORY

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