886950-2-3259-J — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

886950-2-3259-J: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.620 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.485 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND POSITIVE OUTPUTS, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-294-9779, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

886950-2-3259-J

NSN: 5962-01-294-9779
FSC: 5962 — Microcircuits, Electronic
CAGE: 0VGU1 — NORTH ATLANTIC INDUSTRIES, INC. DBA NORTH ATLANTIC INDUSTRIES (USA)

SPECIFICATIONS

body_width	0.620 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.485 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND POSITIVE OUTPUTS
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	15 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-294-9779

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 15 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.620 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	15 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.620 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	1.485 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

886353Reference document

Same NSN cross-reference

Reference document — Secondary reference

650182Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 063Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 886950-2-3259-J?

886950-2-3259-J is a MICROCIRCUIT,MEMORY.

What parts can replace 886950-2-3259-J?

There are 3 known substitutes for 886950-2-3259-J: 886353, 650182, ROM/PROM FAMILY 063. Substitute compatibility should be verified for your specific system.

What is the NSN for 886950-2-3259-J?

886950-2-3259-J is cataloged in the U.S. Government catalog under NSN 5962-01-294-9779. This indicates validated use in U.S. government and defense supply chains.

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