886353 — MICROCIRCUIT,MEMORY

✓ Government record, cited

Spin Master · COMPONENT

PRODUCT OVERVIEW

886353: MICROCIRCUIT,MEMORY.

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Key specifications include body_width: 0.620 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.485 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE AND ERASABLE AND MONOLITHIC, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S. Government catalog under NSN 5962-01-294-9779, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

886353

NSN: 5962-01-294-9779
NIINs: 012949779, 012950293, 012950294
FSC: 5962 — Microcircuits, Electronic
CAGE: 07342 — NAI TECHNOLOGIES INC (USA)

SPECIFICATIONS

body_width	0.620 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.485 INCHES MAXIMUM IN
features_provided	PROGRAMMABLE AND ERASABLE AND MONOLITHIC
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	15 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-294-9779

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 15 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.620 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	15 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.620 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND ERASABLE AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	1.485 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

650182Reference document

Same NSN cross-reference

Reference document — Secondary reference

886950-2-3259-JReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 063Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 886353?

886353 is a MICROCIRCUIT,MEMORY manufactured by Spin Master.

What parts can replace 886353?

There are 3 known substitutes for 886353: 650182, 886950-2-3259-J, ROM/PROM FAMILY 063. Substitute compatibility should be verified for your specific system.

What is the NSN for 886353?

886353 is cataloged in the U.S. Government catalog under NSN 5962-01-294-9779. This indicates validated use in U.S. government and defense supply chains.

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886353 — MICROCIRCUIT,MEMORY

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