The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.410 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 0.190 INCHES MAXIMUM IN, overall_diameter: 0.250 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-636-2940, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.410 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 0.190 INCHES MAXIMUM IN |
| overall_diameter | 0.250 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 1 BINDING POST AND 1 PIN |
| maximum_operating_temp_per_measurement_point | 150.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5961-00-636-2940 |
| TERMINAL TYPE AND QUANTITY | 1 BINDING POST AND 1 PIN |
| MATERIAL | SILICON SEMICONDUCTOR |
| MATERIAL | GLASS ENCLOSURE |
| OVERALL LENGTH | 0.410 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 0.190 INCHES MAXIMUM IN |
| MOUNTING METHOD | TERMINAL |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS AMBIENT AIR DEGC |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL DIAMETER | 0.250 INCHES MAXIMUM IN |