The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.150 INCHES MAXIMUM IN, body_height: 0.045 INCHES MAXIMUM IN, body_length: 0.260 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED, output_logic_form: DIODE LOGIC, inclosure_material: CERAMIC OR GLASS OR METAL. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-045-8212, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.150 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MAXIMUM IN |
| body_length | 0.260 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED |
| output_logic_form | DIODE LOGIC |
| inclosure_material | CERAMIC OR GLASS OR METAL |
| memory_device_type | DIODE MATRIX |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-045-8212 |
| MEMORY DEVICE TYPE | DIODE MATRIX |
| BODY WIDTH | 0.150 INCHES MAXIMUM IN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| BODY LENGTH | 0.260 INCHES MAXIMUM IN |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| BODY HEIGHT | 0.045 INCHES MAXIMUM IN |
| MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
| OUTPUT LOGIC FORM | DIODE LOGIC |