The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.150 INCHES MAXIMUM IN, body_height: 0.045 INCHES MAXIMUM IN, body_length: 0.260 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED, output_logic_form: DIODE LOGIC, inclosure_material: CERAMIC OR GLASS OR METAL. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-045-8206, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.150 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MAXIMUM IN |
| body_length | 0.260 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED |
| output_logic_form | DIODE LOGIC |
| inclosure_material | CERAMIC OR GLASS OR METAL |
| memory_device_type | DIODE MATRIX |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-045-8206 |
| OUTPUT LOGIC FORM | DIODE LOGIC |
| BODY HEIGHT | 0.045 INCHES MAXIMUM IN |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INPUT CIRCUIT PATTERN | 6 INPUT |
| MEMORY DEVICE TYPE | DIODE MATRIX |
| BODY LENGTH | 0.260 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | CERAMIC OR GLASS OR METAL |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED |
| TERMINAL SURFACE TREATMENT | SOLDER |