The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.150 INCHES MAXIMUM IN, body_height: 0.045 INCHES MAXIMUM IN, body_length: 0.260 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED, output_logic_form: DIODE LOGIC, inclosure_material: CERAMIC OR GLASS OR METAL. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-045-8209, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.150 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MAXIMUM IN |
| body_length | 0.260 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED |
| output_logic_form | DIODE LOGIC |
| inclosure_material | CERAMIC OR GLASS OR METAL |
| memory_device_type | DIODE MATRIX |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 6 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-045-8209 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| OUTPUT LOGIC FORM | DIODE LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED |
| INCLOSURE MATERIAL | CERAMIC OR GLASS OR METAL |
| BODY HEIGHT | 0.045 INCHES MAXIMUM IN |
| MEMORY DEVICE TYPE | DIODE MATRIX |
| INCLOSURE CONFIGURATION | FLAT PACK |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |