The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, memory_capacity: 512 X 8, special_features: PROGRAM TO CAGE 07187 DWG TT8511840-100, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-531-1580, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| memory_capacity | 512 X 8 |
| special_features | PROGRAM TO CAGE 07187 DWG TT8511840-100 |
| features_provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-531-1580 |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| MEMORY DEVICE TYPE | PROM |
| INCLOSURE MATERIAL | CERAMIC |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| MAXIMUM POWER DISSIPATION RATING | 880.0 MILLIWATTS |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, DIGITAL - BIPOLAR PROM 512 X 8 |
| MEMORY CAPACITY | 512 X 8 |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| SPECIAL FEATURES | PROGRAM TO CAGE 07187 DWG TT8511840-100 |