ROM/PROM FAMILY 277: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, memory_capacity: 512 X 8, special_features: PROGRAM TO CAGE 07187 DWG TT8511840-100, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-250-6923, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| memory_capacity | 512 X 8 |
| special_features | PROGRAM TO CAGE 07187 DWG TT8511840-100 |
| features_provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-250-6923 |
| FEATURES PROVIDED | PROGRAMMED |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
No substitute or cross-reference records for this part.