8507006-162 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8507006-162: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, special_features: PROGRAMMED PAL16L8-15, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-339-3148, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8507006-162

NSN: 5962-01-339-3148
NIINs: 013393148, 013400197, 013400198, 013440776, 013838366
FSC: 5962 — Microcircuits, Electronic
CAGE: 07187 — HONEYWELL INTERNATIONAL INC. DBA HONEYWELL INTERNATIONAL (USA)

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
special_features	PROGRAMMED PAL16L8-15
features_provided	BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
NSN	5962-01-339-3148

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: BIPOLAR AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: PAL

•

OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

•

TERMINAL TYPE AND QUANTITY: 20 LEADLESS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	BIPOLAR AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	PAL
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
TERMINAL TYPE AND QUANTITY	20 LEADLESS

SUBSTITUTES & CROSS-REFERENCES 2

10133899Reference document

Same NSN cross-reference

Reference document — Informative reference only

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 8507006-162?

8507006-162 is a MICROCIRCUIT,MEMORY.

What parts can replace 8507006-162?

There are 2 known substitutes for 8507006-162: 10133899, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 8507006-162?

8507006-162 is cataloged in the U.S. Government catalog under NSN 5962-01-339-3148. This indicates validated use in U.S. government and defense supply chains.

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8507006-162 — MICROCIRCUIT,MEMORY

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