10133899 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

10133899: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BIPOLAR AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL, inclosure_configuration: LEADLESS FLAT PACK, terminal_surface_treatment: SOLDER. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-339-3148, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

10133899

NSN: 5962-01-339-3148
FSC: 5962 — Microcircuits, Electronic
CAGE: A486G — NIMIKKEISTOKESKUS NCB FINLAND (FIN)

SPECIFICATIONS

features_provided	BIPOLAR AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 LEADLESS
NSN	5962-01-339-3148

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: BIPOLAR AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: PAL

•

OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

•

TERMINAL TYPE AND QUANTITY: 20 LEADLESS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	BIPOLAR AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	PAL
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
TERMINAL TYPE AND QUANTITY	20 LEADLESS

SUBSTITUTES & CROSS-REFERENCES 2

8507006-162Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 10133899?

10133899 is a MICROCIRCUIT,MEMORY.

What parts can replace 10133899?

There are 2 known substitutes for 10133899: 8507006-162, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 10133899?

10133899 is cataloged in the U.S. Government catalog under NSN 5962-01-339-3148. This indicates validated use in U.S. government and defense supply chains.

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10133899 — MICROCIRCUIT,MEMORY

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